MANUFACTURING


- Overview


- Manufacturing services


- Rigid Capabilities


- Flex Capabilities


- Product Range


manufacturing |


Rigid PCB Production Capabilities


Parameter

Standard Capability

Advanced Capability

Trace width / clearance

8mil

4mil

Min drilled hole diameter

15mil

12mil

Min copper thickness (outer layer)

1oz

1/3oz

Max copper thickness (outer layer)

1oz

6oz

Min copper thickness (inner layer)

0.5oz

0.5oz

Max copper thickness (inner layer)

1oz

6oz

Surface finishing

HAL

Immersion gold
Deposited nickel/gold
OSP

FR4 material

Tg130

Tg170

 

Home | About Us | Design | Manufacturing | Assembly | Links | Contact

 

© Copyright 2009 QdosTech